maxiFLOW™ - is a patented heat sink design that provides the best thermal performance for the space it occupies. maxiFLOW™ designed heat sink have thermal performance that is 30– 200% better than the conventional heat sinks.

Cross Cut – these heat sinks are specifically designed to be omni-directional and provide the best performance at low air velocity flows.

maxiGRIP™ Attachment – this is a patented design that attaches a heat sink to a BGA device. It utilizes a combination plastic frame clip and stainless steel wire spring clip to attach the heat sink to the device. It meets the NEBS and MIL-Spec standards and eliminates the need to place any holes on the PCB.

Straight Fin - these heat sinks are specifically designed to provide the best performance at low air velocity flows and be placed in locations on PCB where there space is limited.

superGRIP™ Attachment - this is a patented design that attaches a heat sink to a BGA device. It utilizes a combination plastic frame clip and stainless steel flat-stock spring clip to attach the heat sink to the device. It has past NEBS and MIL-Spec standards and eliminates the need to place any holes on the PCB. superGRIP™ is uniquely suited for devices that keep-out area is limited.

superGRIP™ is not available by distribution, Please Contact ATS »

When required, ATS will generate a heat sink design, characterize its performance, fabricate prototypes, and manufacture production volumes to meet any application need.