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  • 121.0 x 121.0 x 64.0 mm BGA Heat Sink - High Performance Ultra-Cool High-Power Device Coolers
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ATS-3012-C5-R0-EXPLODED
*Image above is for illustration purpose only..
121.0 x 121.0 x 64.0 mm  BGA Heat Sink - High Performance Ultra-Cool High-Power Device Coolers
Heat Sink
Product Details
  • ATS-ARGUS-D200
  • 121.0 x 121.0 x 64.0 mm  BGA Heat Sink - High Performance Ultra-Cool High-Power Device Coolers
  • Heat Sink with Blower
  • Hardware Kit - ATS-HK152-R2
  • N/A
  • See detail
  • See detail
Specifications
  • Ideal for 2U applications where space and airflow are restricted
  • Designed for CPU's, GPU's, and FPGA's in high-performance 2U chassis. Designed to fit the Intel™ LGA2011 square and LGA2066 (Socket R) sockets
  • Mechanical attachment is standoff, screws, and spring – for other types of attachments contact ATS
  • Provided with Chomerics T670 thermal grease
  • Hardware provides 25 PSI when used in socket LGA2011. For other applications please email ats-hq@qats.com
  • To apply this heat sink to other high power devices and processors contact ATS
  • Provides at least 20% improvement over comparable products on the market
  • Patented
Product Details
Part Number Lifecycle Status Length
(mm)		 Width
(mm)		 Height
(mm)		 Fin Material Mounting Hole Width
(mm) 		Mounting Hole Height
(mm) 		Weight
(g) 		Lead Wire
Pin Out 		TIM FINISH
ATS-ARGUS-D200 ACTIVE 121.0 121.0 64.0 Cu 80 80 970 4 Wire T670 Thermal Grease Nickel Plated
Designed for cooling dense 2U applications, provides at least 20% improvement over comparable products on the market. Minimum Chassis Height for Cooler is 2U
Thermal Performance
Schematic Image
cryoQOOL
*Image above is for illustration purpose only.
A: Length B: Width C: Height D : Mounting Hole Width E : Mounting Hole Length
FAN RATED
VOLTAGE (Vdc)		 FAN OPERATING VOLTAGE
RANGE (Vdc)		 RATED SPEED
(RPM)		 RATED INPUT
POWER (W)		 RATED AIRFLOW
(CFM)		 NOISE LEVEL
(dB)		 AIR PRESSURE
(mmHO)		 R
(°C/W)		 MAX TDP (W)
(2)		 FAN LIFE
EXPECTANCY (L ) HOURS
48 30 ~ 60 7,400 17.28 71.7 65 72.1 0.14 229 40,000 at 60°C
  1. Thermal performance data is provided for reference only. Actual performance may vary by application
  2. Max TDP (thermal design power) – maximum amount of heat generated by component
  3. Thermal performance is based on Rated Speed at Duty Cycle 100% RPM
  4. ATS reserves the right to update or change its products without notice to improve the design or performance
  5. RoHS-6 and REACH compliant

ATS-ARGUS-D200   (Data Sheet)
121.0 x 121.0 x 64.0 mm  BGA Heat Sink - High Performance Ultra-Cool High-Power Device Coolers 		download data sheet
ATS-ARGUS-D200
Mechanical Drawing - FUSED MODEL (used for Form and Fit use) 		download fused Model for Form and Fit use
superGRIP™
Installation & Removal		 download data sheet
superGRIP™
Clearance Guidelines		 download data sheet
ATS-maxiGRIP
Installation Guidelines		 download data sheet
ATS-maxiGRIP
Clearance Guidelines		 download data sheet
RoHS
Obtain RoHS Certificate		 download data sheet