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  • 137.0 x 97.6 x 47.8 mm BGA Heat Sink - High Performance Ultra-Cool High-Power Device Coolers
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ATS-3012-C5-R0-EXPLODED
*Image above is for illustration purpose only..
137.0 x 97.6 x 47.8 mm  BGA Heat Sink - High Performance Ultra-Cool High-Power Device Coolers
Heat Sink
Product Details
  • ATS-UC-CRYQL-100
  • 137.0 x 97.6 x 47.8 mm  BGA Heat Sink - High Performance Ultra-Cool High-Power Device Coolers
  • Heat Sink with High-Performance Fans
  • Hardware Kit - ATS-HK349-R1
  • N/A
  • See detail
  • See detail
Specifications
  • Ideal for 2U applications where space and airflow are restricted
  • Designed for CPUs that fit the Intel™ LGA2011 square, LGA2066 sockets (Socket R) and LGA1366 sockets
  • Mechanical attachment is PEM, screws and spring – for other types of attachments contact ATS
  • Provided with Chomerics T670 thermal grease
  • Hardware provides 21 psi of mounting pressure when installed on component in socket LGA2011
  • PWM enabled fans: Voltage 12VDC (10.8 min – 12.6 max), Current 1.52A per fan
  • Provides at least 50% improvement over comparable products on the market
  • To apply this heat sink to other high power devices and processors contact ATS
  • Patent
Product Details
Part Number Lifecycle Status Length
(mm)		 Width
(mm)		 Height
(mm)		 Fin Material Mounting Hole Width
(mm) 		Mounting Hole Height
(mm) 		Weight
(g) 		Lead Wire
Pin Out 		TIM FINISH
ATS-UC-CRYQL-100 ACTIVE 137.0 97.6 47.8 Cu 80 80 1610 4 Wire T670 Thermal Grease None
Designed for cooling dense 2U applications, provides at least 50% improvement over comparable products on the market. Minimum Chassis Height for Cooler is 2U
Thermal Performance
Schematic Image
cryoQOOL
*Image above is for illustration purpose only.
A: Length B: Width C: Height D : Mounting Hole Width E : Mounting Hole Length
FAN RATED
VOLTAGE (Vdc)		 FAN OPERATING VOLTAGE
RANGE (Vdc)		 RATED SPEED
(RPM)		 RATED INPUT
POWER (W)		 RATED AIRFLOW
(CFM)		 NOISE LEVEL
(dB)		 AIR PRESSURE
(mmHO)		 R
(°C/W)		 MAX TDP (W)
(2)		 FAN LIFE
EXPECTANCY (L ) HOURS
12 10.8 ~ 12.6 25,000 36.6 58.6 65 112 0.12 267 40,000 at 60°C
  1. Thermal performance data is provided for reference only. Actual performance may vary by application.
  2. Thermal resistance data are for 40 x 40mm component.
  3. Thermal performance is based on both fans running at 100% PWM duty cycle
  4. The fan connector can be mated to a system in the following ways: via a computer motherboard”s included 4-pin header, to a standard 4-pin fan header such as the Molex 0470531000 or a standard 3-pin fan header. If a 3-pin header is used, the speed control option cannot be accessed.
  5. Lead wires: Pin 1-Black (-), Pin 2-Red (+12V), Pin 3-Yellow (Tach), Pin 4-Blue (PWM)
  6. Max TDP (thermal design power) – maximum amount of heat generated by component
  7. ATS reserves the right to update or change its products without notice to improve the design or performance
  8. RoHS-6 and REACH compliant

ATS-UC-CRYQL-100   (Data Sheet)
137.0 x 97.6 x 47.8 mm  BGA Heat Sink - High Performance Ultra-Cool High-Power Device Coolers 		download data sheet
ATS-UC-CRYQL-100
Mechanical Drawing - FUSED MODEL (used for Form and Fit use) 		download fused Model for Form and Fit use
superGRIP™
Installation & Removal		 download data sheet
superGRIP™
Clearance Guidelines		 download data sheet
ATS-maxiGRIP
Installation Guidelines		 download data sheet
ATS-maxiGRIP
Clearance Guidelines		 download data sheet
RoHS
Obtain RoHS Certificate		 download data sheet