Application Notes for maxiFLOW superGRIP Low Profile
Low-profile maxiFLOW™ heat sinks are designed for component heights ranging from 1.5-2.99 mm and the specially-designed fin array increases the surface area to provide the highest thermal performance per volume occupied when compared to other heat sinks on the market.
The low-profile, spread-fin array maximizes surface area and enhances convection cooling, while superGRIP™ attachment technology offers secure hold without a significant increase in footprint or the need to drill holes in the board.
Using superGRIP™ heat sink attachment technology also gives design engineers more flexibility because of their easy assembly and removal. There is no damage to the board, which is important because of dense PCB routing and the potential need for rework.