*Image above is for illustration purpose only..
40.0 x 40.0 x 19.5 mm  BGA Heat Sink - High Performance maxiFLOW/superGRIP-Low-Profile
Heat Sink
Product Details
  • ATS-X51400R-C1-R0
  • 40.0 x 40.0 x 19.5 mm  BGA Heat Sink - High Performance maxiFLOW/superGRIP-Low-Profile
  • maxiFLOW
  • superGRIP
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Specifications
  • Requires minimal space around the component's perimeter; ideal for densely populated PCBs
  • Allows the heat sink to be detached and reattached without damaging the component or the PCB, an important feature in the event a PCB may need to be reworked
  • Strong, uniform attachment force helps achieve maximum performance from phase-change TIMs
  • Eliminates the need to drill mounting holes in the PCB
  • Assembly comes standard with a high performance maxiFLOW™ heat sink, which maximizes convection (air) cooling. Please refer to the superGRIP™  Keep-Out Guidelines and superGRIP™  Installation/Removal Guide for further details
  • Comes standard with clean break, reworkable, Chomerics T-766 phase change material
  • Designed for standard height components, from 1.5 to 2.9 mm
Product Details
Part Number Lifecycle Status Length
(mm)
Width
(mm)
Height
(mm)
Fin Tip to Fin Tip
(mm)
TIM FINISH
ATS-X51400R-C1-R0 ACTIVE 40.0 40.0 19.5 69.1 T766 Blue Anodized

Application Notes for maxiFLOW superGRIP Low Profile

Low-profile maxiFLOW™ heat sinks are designed for component heights ranging from 1.5-2.99 mm and the specially-designed fin array increases the surface area to provide the highest thermal performance per volume occupied when compared to other heat sinks on the market.

The low-profile, spread-fin array maximizes surface area and enhances convection cooling, while superGRIP™ attachment technology offers secure hold without a significant increase in footprint or the need to drill holes in the board.

Using superGRIP™ heat sink attachment technology also gives design engineers more flexibility because of their easy assembly and removal. There is no damage to the board, which is important because of dense PCB routing and the potential need for rework.

Thermal Performance
Schematic Image. AIR VELOCITY THERMAL RESISTANCE
FT/MIN M/S °C/W Unducted Flow °C/W Ducted Flow

*Image above is for illustration purpose only.
A: Length B: Width C: Height D : Fin Tip to Fin Tip.
100 0.5 N/A N/A
200 1.0 2.0 1.5
300 1.5 1.6 N/A
400 2.0 1.4 N/A
500 2.5 1.2 N/A
600 3.0 1.1 N/A
700 3.5 1.0 N/A
800 4.0 1.0 N/A
ATS-X51400R-C1-R0   (Data Sheet)
40.0 x 40.0 x 19.5 mm  BGA Heat Sink - High Performance maxiFLOW/superGRIP-Low-Profile
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ATS-MaxiGRIP
Shock and Vibe Compliance Data
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superGRIP™
Installation & Removal
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superGRIP™
Clearance Guidelines
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ATS-maxiGRIP
Installation Guidelines
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ATS-maxiGRIP
Clearance Guidelines
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RoHS
Obtain RoHS Certificate
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