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  • 21.0 x 21.0 x 8.9 mm BGA Heat Sink (High Aspect Ratio Ext.) Standard Pin Fin
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ATS-3012-C5-R0-EXPLODED
*Image above is for illustration purpose only..
21.0 x 21.0 x 8.9 mm  BGA Heat Sink (High Aspect Ratio Ext.) Standard Pin Fin
Heat Sink
Product Details
  • ATS021021009-PF011
  • 21.0 x 21.0 x 8.9 mm  BGA Heat Sink (High Aspect Ratio Ext.) Standard Pin Fin
  • N/A
  • Standard Pin Fin
  • N/A
  • N/A
  • See detail
  • See detail
Specifications
  • Excellent balance of low cost and high performance in an aluminum heat sink.
  • Designed for semiconductor devices with omni-directional airflow requirements.
  • 6x6 pin array
  • Available with a variety of thermal adhesive tape options. Contact sales@qats.com for product configurations.
Product Details
Part Number Lifecycle Status Length
(mm)		 Width
(mm)		 Height
(mm)		 Fin Tip to Fin Tip
(mm)		 TIM FINISH
ATS021021009-PF011 ACTIVE 21.0 21.0 8.9 N/A NO TIM Black Anodized
Thermal Performance
Schematic Image. AIR VELOCITY THERMAL RESISTANCE
FT/MIN M/S °C/W Unducted Flow °C/W Ducted Flow

*Image above is for illustration purpose only.
A: Length B: Width C: Height D : Fin Tip to Fin Tip. 		100 0.5 N/A N/A
200 1.0 19.0 0.0
300 1.5 N/A N/A
400 2.0 N/A N/A
500 2.5 N/A N/A
600 3.0 N/A N/A
700 3.5 N/A N/A
800 4.0 N/A N/A
ATS021021009-PF011   (Data Sheet)
21.0 x 21.0 x 8.9 mm  BGA Heat Sink (High Aspect Ratio Ext.) Standard Pin Fin		 download data sheet
ATS021021009-PF011
Mechanical Drawing - FUSED MODEL (used for Form and Fit use) 		download fused Model for Form and Fit use
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