maxiFLOW™ heat sinks with
maxiGRIP™ attachment offers the best performing heat sink with ease of attachment to the BGA package. BGA packages, due to RoHS requirements, come in different heights. ATS offers the largest selection heat sinks with state-of-the-art attachments for standard component heights between 3mm to 4.5mm. Because of the dense PCB routing, holes on the board are not readily available, making
maxiFLOW™ with maxiGRIP™ attachment ideally suited for such applications.