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Low-Profile Heat Sinks

Low-Profile Heat Sinks and Attachments for Electronics Systems

ATS has a range of low-profile heat sinks and attachment technologies for electronics systems with limited space and airflow. From ultra-low-profile blueICE™ heat sinks to low-profile maxiFLOW™ and straight-fin heat sinks, ATS has solutions for tough-to-cool systems, such as telecommunications or IoT, where space is at a premium. Choose from several attachment methods, including thermal tape or high-performance maxiGRIP™ or superGRIP™.

  • blueICE

    blueICE™ w/ Thermal Tape

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  • Low Profile maxiFLOW w/ maxiGRIP

    Low Profile maxiFLOW w/ maxiGRIP

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  • Low Profile maxiFLOW w/ superGRIP

    Low Profile maxiFLOW w/ superGRIP

  • Low Profile straightFIN w/ superGRIP

    Low Profile straightFIN w/ superGRIP

  • Low Profile Heatsink IoT

    Custom Low Profile

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