Low-Profile Heat Sinks
Low-Profile Heat Sinks and Attachments for Electronics Systems
ATS has a range of low-profile heat sinks and attachment technologies for electronics systems with limited space and airflow. From ultra-low-profile blueICE™ heat sinks to low-profile maxiFLOW™ and straight-fin heat sinks, ATS has solutions for tough-to-cool systems, such as telecommunications or IoT, where space is at a premium. Choose from several attachment methods, including thermal tape or high-performance maxiGRIP™ or superGRIP™.
Low Profile maxiFLOW w/ superGRIP
Low Profile straightFIN w/ superGRIP