*Image above is for illustration purpose only..
20.0 x 41.4 x 32.8 mm  BGA Heat Sink - High Performance Device Specific - TI
Heat Sink
Product Details
  • ATS-TI1OP-1918-C1-R0
  • 20.0 x 41.4 x 32.8 mm  BGA Heat Sink - High Performance Device Specific - TI
  • TI
  • Heat Sinks Come with Two Threaded Mounting Holes
  • N/A
  • See detail
  • See detail
Specifications
  • Optimized for natural convection air cooling
  • Black anodized for maximum heat dissipation
  • Designed specifically for TI products that use the DKQ 56 or DDV 44 packages, such as TAS6424, TAS6422, TPA6304, TPA6404, and others
  • Heat sinks come with two threaded mounting holes
Product Details
Part Number Lifecycle Status Length
(mm)
Width
(mm)
Height
(mm)
Fin Tip to Fin Tip
(mm)
TIM FINISH
ATS-TI1OP-1918-C1-R0 ACTIVE 20.0 41.4 32.8 32.5 N/A BLACK-ANODIZED
Thermal Performance
Schematic Image. AIR VELOCITY THERMAL RESISTANCE
FT/MIN M/S °C/W Unducted Flow °C/W Ducted Flow

*Image above is for illustration purpose only.
A: Length B: Width C: Height D : Fin Tip to Fin Tip.
100 0.5 N/A N/A
200 1.0 4.6 3.4
300 1.5 3.8 2.9
400 2.0 3.4 2.6
500 2.5 3.1 2.3
600 3.0 2.8 2.1
700 3.5 2.6 2.0
800 4.0 2.5 1.9
ATS-TI1OP-1918-C1-R0   (Data Sheet)
20.0 x 41.4 x 32.8 mm  BGA Heat Sink - High Performance Device Specific - TI
download data sheet
ATS-TI1OP-1918-C1-R0
Mechanical Drawing - FUSED MODEL (used for Form and Fit use)
download fused Model for Form and Fit use
superGRIP™
Installation & Removal
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superGRIP™
Clearance Guidelines
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ATS-maxiGRIP
Installation Guidelines
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ATS-maxiGRIP
Clearance Guidelines
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RoHS
Obtain RoHS Certificate
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