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  • 36.0 x 78.0 x 35.6 mm BGA Heat Sink - High Performance Device Specific - TI
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ATS-3012-C5-R0-EXPLODED
*Image above is for illustration purpose only..
36.0 x 78.0 x 35.6 mm  BGA Heat Sink - High Performance Device Specific - TI
Heat Sink
Product Details
  • ATS-TI1OP-519-C1-R3
  • 36.0 x 78.0 x 35.6 mm  BGA Heat Sink - High Performance Device Specific - TI
  • N/A
  • TI
  • Heat Sinks Come with Two Threaded Mounting Holes
  • N/A
  • See detail
  • See detail
Specifications
  • Designed specifically for TI’s Module #TAS5624, (#TAS5624DDVEVM), #TAS5622, (#TAS5622DDVEVM)
  • Heat sinks come with 2 4-40 taped threaded holes
  • Optimized for natural convection air cooling
  • Black anodized for maximum heat dissipation
Product Details
Part Number Lifecycle Status Length
(mm)		 Width
(mm)		 Height
(mm)		 Fin Tip to Fin Tip
(mm)		 TIM FINISH
ATS-TI1OP-519-C1-R3 ACTIVE 36.0 78.0 35.6 N/A BLACK-ANODIZED
Thermal Performance
Schematic Image. AIR VELOCITY THERMAL RESISTANCE
FT/MIN M/S °C/W Unducted Flow °C/W Ducted Flow

*Image above is for illustration purpose only.
A: Length B: Width C: Height D : Fin Tip to Fin Tip. 		100 0.5 N/A N/A
200 1.0 N/A N/A
300 1.5 N/A N/A
400 2.0 N/A N/A
500 2.5 N/A N/A
600 3.0 N/A N/A
700 3.5 N/A N/A
800 4.0 N/A N/A
ATS-TI1OP-519-C1-R3   (Data Sheet)
36.0 x 78.0 x 35.6 mm  BGA Heat Sink - High Performance Device Specific - TI		 download data sheet
ATS-TI1OP-519-C1-R3
Mechanical Drawing - FUSED MODEL (used for Form and Fit use) 		download fused Model for Form and Fit use
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