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  • 29.0 x 37.0 x 10.0 mm BGA Heat Sink - High Performance Device Specific - NXP
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ATS-3012-C5-R0-EXPLODED
*Image above is for illustration purpose only..
29.0 x 37.0 x 10.0 mm  BGA Heat Sink - High Performance Device Specific - NXP
Heat Sink
Product Details
  • ATS-59005-C1-R0
  • ATS-59005-C2-R0 Discontinued
  • 29.0 x 37.0 x 10.0 mm  BGA Heat Sink - High Performance Device Specific - NXP
  • N/A
  • NXP
  • maxiGRIP
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  • See detail
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Specifications
  • Designed for flip-chip processors such as NXP MPCs
  • maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB
  • Comes preassembled with high performance, phase changing, thermal interface material
Product Details
Part Number Lifecycle Status Length
(mm)		 Width
(mm)		 Height
(mm)		 Fin Tip to Fin Tip
(mm)		 TIM FINISH
ATS-59005-C1-R0 ACTIVE 29.0 37.0 10.0 54.0 T766 BLACK-ANODIZED
Thermal Performance
Schematic Image. AIR VELOCITY THERMAL RESISTANCE
FT/MIN M/S °C/W Unducted Flow °C/W Ducted Flow

*Image above is for illustration purpose only.
A: Length B: Width C: Height D : Fin Tip to Fin Tip. 		100 0.5 N/A N/A
200 1.0 6.2 3.8
300 1.5 5.0 N/A
400 2.0 4.2 N/A
500 2.5 3.7 N/A
600 3.0 3.3 N/A
700 3.5 3.0 N/A
800 4.0 2.8 N/A
ATS-59005-C1-R0   (Data Sheet)
29.0 x 37.0 x 10.0 mm  BGA Heat Sink - High Performance Device Specific - NXP		 download data sheet
ATS-59005-C1-R0
Mechanical Drawing - FUSED MODEL (used for Form and Fit use) 		download fused Model for Form and Fit use
superGRIP™
Installation & Removal		 download data sheet
superGRIP™
Clearance Guidelines		 download data sheet
ATS-maxiGRIP
Installation Guidelines		 download data sheet
ATS-maxiGRIP
Clearance Guidelines		 download data sheet
RoHS
Obtain RoHS Certificate		 download data sheet