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  • 100.0 x 87.0 x 16.0 mm BGA Heat Sink - High Performance Device Specific - NVIDIA
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ATS-3012-C5-R0-EXPLODED
*Image above is for illustration purpose only..
100.0 x 87.0 x 16.0 mm  BGA Heat Sink - High Performance Device Specific - NVIDIA
Heat Sink
Product Details
  • ATS-NVP-3275-C3-R0
  • 100.0 x 87.0 x 16.0 mm  BGA Heat Sink - High Performance Device Specific - NVIDIA
  • NVIDIA® Jetson AGX Xavier and Jetson AGX Orin
  • Straight fin
  • Stainless steel screw
  • N/A
  • See detail
  • See detail
Specifications

NVIDIA Heat Sinks Features & Benefits

  • Designed to fit the NVIDIA® Jetson AGX Xavier™ and Jetson AGX Orin™ modules.
  • Provided with pre-assembled Thermal Interface Material (TIM) on base
  • Mounting Screws - M3x0.5 (3mm standard) - Thread length: 30
  • Recommended through hole size in PCB is 3.40 mm
Product Details
Part Number Lifecycle Status Length
(mm)		 Width
(mm)		 Height
(mm)		 Fin Tip to Fin Tip
(mm)		 TIM FINISH
ATS-NVP-3275-C3-R0 ACTIVE 100.0 87.0 16.0 N/A Chomerics T412 Black Anodized
Thermal Performance
Schematic Image. AIR VELOCITY THERMAL RESISTANCE
FT/MIN M/S °C/W Unducted Flow °C/W Ducted Flow

*Image above is for illustration purpose only.
A: Length B: Width C: Height D : Fin Tip to Fin Tip. 		100 0.5 N/A N/A
200 1.0 0.5 N/A
300 1.5 N/A N/A
400 2.0 0.3 N/A
500 2.5 N/A N/A
600 3.0 0.3 N/A
700 3.5 N/A N/A
800 4.0 0.2 N/A
ATS-NVP-3275-C3-R0   (Data Sheet)
100.0 x 87.0 x 16.0 mm  BGA Heat Sink - High Performance Device Specific - NVIDIA		 download data sheet
ATS-NVP-3275-C3-R0
Mechanical Drawing - FUSED MODEL (used for Form and Fit use) 		download fused Model for Form and Fit use
superGRIP™
Installation & Removal		 download data sheet
superGRIP™
Clearance Guidelines		 download data sheet
ATS-maxiGRIP
Installation Guidelines		 download data sheet
ATS-maxiGRIP
Clearance Guidelines		 download data sheet
RoHS
Obtain RoHS Certificate		 download data sheet