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  • 92.4 x 92.1 x 29.0 mm BGA Heat Sink - High Performance Ultra-Cool High-Power Device Coolers
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ATS-3012-C5-R0-EXPLODED
*Image above is for illustration purpose only..
92.4 x 92.1 x 29.0 mm  BGA Heat Sink - High Performance Ultra-Cool High-Power Device Coolers , Vapor Chamber base
Heat Sink
Product Details
  • ATS-UC-DFLOW-VC-200
  • 92.4 x 92.1 x 29.0 mm  BGA Heat Sink - High Performance Ultra-Cool High-Power Device Coolers , Vapor Chamber base
  • N/A
  • Heat Sink with Blower
  • PEM
  • N/A
  • See detail
  • See detail
Specifications
  • Designed for for 1U and 2U or any application with front to back air flow Designed for CPUs that fit the Intel™ LGA2011 square and LGA2066 sockets (Socket R)
  • Mechanical attachment is PEM, screws and spring – for other types of attachments contact ATS
  • Provided with Chomerics T670 thermal grease
  • Hardware provides 9.2 PSI (63 kPa) when installed
  • Aluminum and copper heat sink material with standard or dense fin spacing provide a wide set of performance ranges for various applications.
  • For less-dense PCB-layouts, the vapor chamber base maximizes heat spreading from a small heat souce and air enters from two directions.
  • To apply this heat sink to other high power devices and processors such as non-Intel CPU, FPGA, AI Processors, or GPUs the optional ATS-HK379-R0 PCB backing plate can be used, please contact ATS for more details.
Product Details
Part Number Lifecycle Status Length
(mm)		 Width
(mm)		 Height
(mm)		 Fin Tip to Fin Tip
(mm)		 TIM FINISH
ATS-UC-DFLOW-VC-200 ACTIVE 92.4 92.1 29.0 N/A Chomerics T670 thermal grease Nickel Plated
For less-dense PCB layouts, vapor chamber base maximizes heat spreading from small heat sources and air enters from two directions
Thermal Performance
Schematic Image. AIR VELOCITY THERMAL RESISTANCE
FT/MIN M/S °C/W Unducted Flow °C/W Ducted Flow

*Image above is for illustration purpose only.
A: Length B: Width C: Height D : Fin Tip to Fin Tip. 		100 0.5 N/A 0.2
200 1.0 N/A N/A
300 1.5 N/A N/A
400 2.0 N/A N/A
500 2.5 N/A N/A
600 3.0 N/A N/A
700 3.5 N/A N/A
800 4.0 N/A N/A
ATS-UC-DFLOW-VC-200   (Data Sheet)
92.4 x 92.1 x 29.0 mm  BGA Heat Sink - High Performance Ultra-Cool High-Power Device Coolers , Vapor Chamber base		 download data sheet
ATS-UC-DFLOW-VC-200
Mechanical Drawing - FUSED MODEL (used for Form and Fit use) 		download fused Model for Form and Fit use
superGRIP™
Installation & Removal		 download data sheet
superGRIP™
Clearance Guidelines		 download data sheet
ATS-maxiGRIP
Installation Guidelines		 download data sheet
ATS-maxiGRIP
Clearance Guidelines		 download data sheet
RoHS
Obtain RoHS Certificate		 download data sheet