Electronics packages are numerous and range from BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs, LQFP and many others. ATS offers a large variety of cross cut heat sinks that can be used in a variety of applications where the direction of the airflow is ambiguous. The cross cut tape on allow for the heat sink to receive air from any direction and can be easily attached to the device by a thermally conductive tape.
Cross Cut Features & Benefits
- High efficiency cross-cut design provides low pressure drop characteristics
- Large surface area increases heat sink performance
- Fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduces weight, and keeps costs low
- Provided with pre-assembled high performance thermal tape