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ATS Products

Device Specific Heat Sinks

Industrial LED Heat Sinks and Cooling Solutions
High Performance Device Specific - NVIDIAAdvanced Thermal Solutions, Inc.
  • Designed and purpose built to fit the NVIDIA Jetson Family of modules
  • Passive and active solutions available
  • Straight-fin, black anodized, aluminum heat sinks
  • A fan attachment hardware kit is provided for heat sinks that will use fans. The fans are not included and should be chosen to match performance needs.
Industrial LED Heat Sinks and Cooling Solutions
High Performance Device Specific - NXP
  • Designed for flip-chip processors such as NXP MPCs
  • maxiGRIP™attachment applies steady, even pressure to the component and does not require holes in the PCB
  • Comes preassembled with high performance, phase changing, thermal interface material
Commercial LED Heat Sinks and Cooling Solutions
High Performance Device Specific - Texas Instruments
  • Designed specifically for TI’s Audio Evaluation Modules
  • Heat sinks come with 2 4-40 taped threaded holes
  • Optimized for natural convection air cooling
  • Black anodized for maximum heat dissipation
Commercial LED Heat Sinks and Cooling Solutions
High Performance Device Specific - Analog Devices
  • Designed for the ADI reference designs AD9166,AD9986/8, AD9081/2, and the quad-mxFE
  • Component Attachment: ATS superGRIP™ is a proven high reliability mechanical attachment system
  • Provided with pre-assembled Thermal Interface Material (TIM) centered on based