maxiGRIP™ and superGRIP™ heat sink attachments are the state-of-the-art in attaching a heat sink to a BGA device manufactured by a variety of companies such as Altera, TI, Xilinx, Freescale and many others. superGRIP™ offers the least amount of keep-out area required around a given BGA – once used with a straight fin heat sink, it makes it an ideal cooling solution for high-density PCBs where the thermal requirements and board routing makes the use of other heat sink attachments difficult.
Straight Fin with superGRIP™ Features & Benefits
- The superGRIP™ super strong, uniform attachment force helps achieve maximum performance from phase changing TIM and does not require holes to be drilled in the PCB
- The patented frame and spring clip allows the heat sink to be detached and reattached without damaging the component or the PCB, an important feature in the event a PCB may need to be reworked
- Meets Telcordia GR-63-Core Office Vibration, ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and Unpackaged Drop Testing standards
- Requires minimal space around the component s perimeter; ideal for densely populated PCBs
- "Keep-Out" Requirements: An "un-populated" boarder zone of 3 mm around the component is necessary to facilitate the Installation/Removal of the superGRIPTM. Please refer to the superGRIP™ Clearance Guidelines and superGRIP™ Installation/Removal Guide for further details.