maxiFLOW™ heat sink with a maxiGRIP™ attachment is the ideal combination of the best performing heat sink with an easy attachment to BGA packages, for tough to cool applications. BGA packages, due to RoHS requirements, come in different heights and ATS offers the largest selection of heat sinks with BGA attachments, for component heights between 1.5-2.99mm. Because of the dense PCB routing, holes on the board are not always readily available; therefore, maxiFLOW™ with maxiGRIP™ attachment is ideally suited for such applications. maxiGRIP™ enables a quick, secure attachment from the heat sink to the BGA package, without requiring holes to be drilled on the board.
Low Profile maxiFLOW™ with maxiGRIP™ Features & Benefits
- maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling
- maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes to be drilled in the PCB
- Meets Telcordia GR-63-Core Office Vibration, ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and Unpackaged Drop Testing standards
- Come pre-assembled with high performance, phase change, thermal interface material.
- Designed for standard height components, from 1.5 to 2.9mm.
- "Keep-Out" Requirements: An "Un-Populated" border zone of 5mm around the component is necessary to facilitate the Installation/Removal of the maxiGRIP™. Please refer to the maxiGRIP™ Clearance Guidelines and maxiGRIP™ Installation/Removal Guide for further details.