maxiFLOW™ heat sink design provides the highest thermal performance for the physical volume that it occupies as compared to other heat sink designs. maxiFLOW™ heat sinks are ideally suited to meet the thermal requirements of a broad range of electronics packages, including: BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs and LQFP. Whenever higher cooling capacity is required, maxiFLOW™ with thermal tape can readily be used. The double sided adhesive thermal tape facilitates the attachment of the heat sink to the device.
maxiFLOW™ Features & Benefits
- maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling
- Provides 20% higher thermal performance than alternative straight fin and pin fin heat sinks
- Provided with pre-assembled Chomerics T412 double-sided adhesive
- Custom options available.