ATS has designed a series of custom cooling solutions designed for specific devices such as NXP. To accommodate the most widely used package sizes, a majority of the heat sinks are available in 25x25mm, 29x29mm, and 33x33mm component packages. These heat sinks can be used for flip-chip processors, Linux board support packages (BSPs), Integrated Communications Processors, Host and Integrated Host Processors and many other electronic applications
Device Specific Heat Sink Features & Benefits
- Designed for flip-chip processors such as NXP MPCs
- maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes to be drilled in the PCB
- Comes pre-assembled with high performance, phase change, thermal interface material
- "Keep-Out" Requirements: An "Un-Populated" border zone of 5mm around the component is necessary to facilitate the Installation/Removal of the maxiGRIP™. Please refer to the maxiGRIP™ Clearance Guidelines and maxiGRIP™ Installation/Removal Guide for further details.