ATS provides high-performance heat sinks designed for the NVIDIA Jetson modules widely-used in Robotics machines and other embedded and edge applications. From the high performance Jetson AGX Orin to the small form factor Jetson Orin Nano series, passive (fanless) and active (fan-ready) ATS heat sinks safeguard component life and performance of the NVIDIA Jetson platform.
Each straight-fin, black anodized, aluminum heat sink comes with either mounting screws or a steel leaf spring and screws, for secure mounting on the PCB. A thermal interface material (TIM) is pre-assembled on the attachment side of the heat sink. A fan attachment hardware kit is provided for heat sinks that use Fans, The fans are not included and should be chosen to match performance needs. See recommended manufacturers.
NVIDIA Heat Sinks Features
- Designed to fit the NVIDIA Jetson series
- Provided with leaf spring and screws for secure PCB mounting
- Recommended through hole size in PCB is 3.20 mm (PCB thickness: 1.2 mm)
- Fan assembly hole pattern and attachment kit provided for customer-added fans.
- For heat sinks that require a fan, ATS recommends fans specific to each Jetson family module. Please see a specific Jetson module's datasheet for more information.
- Provided with pre-assembled Thermal Interface Material (TIM) on base